OEM/ODM Services | Bluetooth Module & Beacon Customization

OEM / ODM Excellence Partner

From concept to mass production — end-to-end customization for Bluetooth modules and Bluetooth beacons.
Leverage our proven IoT manufacturing expertise.

Bluetooth Module

OEM / ODM Full Process
1

Concept & Hardware Blueprint

Requirement analysis, PCBA design, component selection (Nordic, TI, etc.), high-speed schematic and RF layout simulation.

2

Firmware Development & Programming

Custom BLE stack, transparent transmission firmware, parameter configuration; factory-level programming and encryption.

3

SMT Assembly & Laser Marking

Fully automated high-precision SMT, 100% AOI inspection; laser engraving for traceability and batch management.

4

100% RF & Functional Test

Comprehensive testing with RF testers – power, sensitivity, power consumption, and communication reliability to ensure zero defects.

5

Automated Packaging & Logistics

Tape & reel / tray packing, ESD protection, global delivery to your assembly lines or end customers.

Bluetooth Beacon

OEM / ODM / JDM Customization
1

Concept & Industrial/Mechanical Design

ID design, MD structure, 3D modeling, IP rating customization, enclosure material & color selection.

2

PCBA & Embedded Development

Core module selection + sensor fusion (temp, humidity, accelerometer), configurable advertising interval, Tx Power, firmware logic.

3

Rapid Prototyping & Tooling Validation

3D printing / mockup verification, mold development, drop test and structural refinement — samples in as few as 4 weeks.

4

Mass Assembly & White‑Label Customization

Fully automated assembly line, silkscreen logo / laser branding, custom packaging and manuals to reflect your brand identity.

5

Compliance Certification & Reliability Testing

CE / FCC / RoHS / BQB support, temperature cycling, ESD testing, ensuring global market entry readiness.

Why Choose Our OEM/ODM Services

Cost & Supply Chain Edge

Optimized component sourcing, standardized development & manufacturing model to deliver high cost-effectiveness.

Advanced Quality Engineering

World-class quality management system, original core chips, and 100% testing to ensure zero-defect delivery.

In-depth Research Competence

20+ senior RF/embedded engineers, full customization from BLE stack to application layer.

Massive Production Scale

108,000 sq.ft automated facility, SMT/DIP/assembly lines, daily output over 100,000 units — reliable lead times.

White‑Label & Branding

Logo printing, custom packaging, private labeling — transform our hardware into your own brand.

Full‑Stack Customization · From Module to Beacon

Hardware Design (Schematic/PCB/RF) Mechanical & Industrial Design (MD/ID) Embedded Firmware (BLE/LoRa/UWB) Mobile App & Software Rapid Prototyping (4‑week samples) 100% Functional & RF Testing Global Compliance (CE/FCC/RoHS/BQB) White‑Label Packaging & Branding Automated SMT / Laser / Assembly Lines

✔ Inspired by industry benchmarks — MinewSemi’s module manufacturing precision & Minew’s end‑to‑end IoT device expertise. Seamless OEM/ODM partnership for Bluetooth modules and beacons, accelerating time‑to‑market.

OEM Manufacturing

Mass production based on your ready‑to‑build designs, with strict quality control and delivery assurance.

ODM Original Design

From concept to finished product — full R&D, design, and manufacturing under one roof.

JDM Joint Development

Co‑engineering partnership to co‑create differentiated Bluetooth modules and beacons.